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Product range
Microsystems technology / sensor systems
Chip & Wire
Thick film hybrid technology
Thin film techniques
PTC-temperature sensors in thick film technology
Printed circuit boards – Express service - Prototypes

Substrats

Materials
Aluminium oxid ceramic 99.6% (Al2O3)
Aluminium nitrid ceramic (AIN)
Quartz glass
Low alkali Borosilikat glass
Other ceramics on demand
Dimensions
Standard: 2“ x 2“, 4“ x 4“
Thickness
Ceramic substrats: 0.254 mm; 0.381 mm; 0.635 mm
Quartz glass: 0.178 mm; 0.254 mm
Other sizes on demand

 

Layers

Materials
TiW / Au
TaN / TiW / Au
TiW / Pd / Au
CrNi / Cu
Surfaces
chem. Ni + Au on copper (solderable and bondable)
galv. Ni + Au on copper (solderable and bondable)
galv. Au (bondable)
chem. Sn on Cu (solderable)
hard gold
Pd-soldering layer sputtered
Layer sizes and spaces
min. 5 µm
tolerance: min. +/- 2 µm


Resistors
Material
CrNi (temperature coefficient adjustable)
TaN (high solid)
Surface resistance
20 ... 200 Ohm/sq
Laser adjustment tolerance
Standard: < 0.5 %; min. < 0.1 %
Temperature coefficient
CrNi: adjustable from –20 to +60 ppm/K
TaN: -90 ppm/K
Tracking: < 5 ppm/K


Technical Feasibilities

Laser cutting and drilling
Separating by sawing
Multiple surfaces technique with through plating
Protection coating
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