Assembling technology for semiconductor
components and microsystems
The Chip & Wire technology which
is well known from the assembling of semiconductor
components and also from hybrid techniques allows
the realization of multichip modules and the assembling
of intelligent miniaturized sensors in microsystems
by complex connecting solutions.
In a combination of Chip &
Wire with SMD mounting and/or thick film technology
we offer up-to-date and reliable customer specific
solutions for different applications.
Chip
bonding |
|
conductive and nonconductive adhesives
for application temperatures up to 350° C |
|
removing of semiconductor chips
from waffle pack or from wafer on foil (sawn) |
|
Flip-Chip and Ball-Grid-Array |
Wire
bonding |
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ultrasonic bonding (Al-wire, Ø20µm
- 32µm) |
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thermosonic bonding (Au-wire, Ø25µm
- 30µm) |
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kinds of wiring devices: measuring
circuits from Al2O3- or AIN ceramic printed circuit
boards, TO-header, special IC carriers on demand |
|
all kind of semiconductor material
with bondable metallization |
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reliability tests as per MIL STD
883 C on demand |
Packaging techniques |
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coating of wire bonded semiconductor
chips with casting components |
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hermetic enclosing in metal packages
by welding in climatic chambers under protection
gas |
|
quasi-hermetic enclosing of special
packages by application of adhesive techniques |
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testing of He-leakage rate according
to MIL STD 883C |
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