Ceramic carriers ...
	printed with layers and adjustable resistors
	assembled with active and passive components
	mounted with semiconductor chips

... are the basis of an integrated construction technology for electronic assemblies and equipment.

With its material specific characteristics, high packing density and flexible design of application and mechanical construction thick film hybrid circuits are the cost-effective alternatives when implementing circuit functions with special concern for the environment.

Technical Specifications

	Ceramic carriers
	aluminium oxyd ceramic 96 % (Al2O3) aluminium nitrid ceramic (AIN) beryllium oxyd ceramic (BeO)
	Dimensions
	up tomax. 6,5"x 4,5" s tandard 4"x 4"
	Size
	Standard 0,635 mm any other sizes (min. 0,25 mm) and forms as per customers’ specifications
	Layers
	AgPd (Rsq ca. 30 mOhm) Au (Rsq ca. 3 mOhm) Ag (Rsq ca. 1,5 mOhm)
	Resistors
	1 W to 30 M Ohm (other factors on demand)
	Adjustment tolerance
	Standard < 1% min. < 0,5%
	TK
	+/- 100 ppm/K +/- 50 ppm/K
	Multilayer
	back side including through plating (min. diameter 100 µm)